Tech scholarships for CUHK eight
Eight students from the Chinese University of Hong Kong have been awarded innovation and technology scholarships, one of the city's most prestigious academic awards worth up to HK$150,000.
The scholarships, organized by the Hong Kong Federation of Youth Groups with the sponsorship of the Innovation and Technology Commission and HSBC, aims to provide undergraduate students with opportunities to broaden their international exposure.
Michelle Szeto Man-sum, a year two public health student, plans to attend the international statistical genetics workshop held by the University of Colorado in Boulder, Colorado, next summer, to learn about skills needed for genetic epidemiology research.
"The scholarship will be a crucial first step for me to realize my aspiration, and I hope I can contribute my passion and knowledge to tackling rare genetic disorders and enhance health equity in society," said Szeto.
Connie Man Hei-siu, a third-year biomedical engineering student and Asia Pacific generation connect youth envoy for the UN International Telecommunication Union, has joined an attachment program as a youth delegate at the ITU world telecommunication development conference youth summit in Rwanda and will be joining the Swiss Federal Institute of Technology Lausanne as a research student.
Other CUHK awardees include students reading physics, earth system science and medicine.
Meanwhile, the robotics team of CUHK's faculty of engineering won first place at the Robocon Hong Kong Contest for the second year in a row and will go on to represent Hong Kong at the Asia-Pacific Robocon Contest to be hosted in New Delhi next month.
CUHK team Golden Striker clinched the Championship and Best Team Spirit Award, while Power Builder came fourth.